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Services
SigmaTron International offers customers Total Manufacturing Solutions that range from Design
for Manufacturability and Testability to Fulfillment. Our value is to understand the customer’s needs and apply a solution that meets their expectations.
SigmaTron International provides the latest manufacturing, process, SMT
assembly, and thru-hole assembly capabilities. We consistently surpass
customer expectations on quality, service, and delivery. Each SigmaTron
International facility possesses the technical depth, processes, and expertise
to support all of your electronic manufacturing requirements.
A list of our capabilities appears below:
- Quick-turn prototyping - Flexible turnaround time from 3 to 5 days from
a complete material kit and complete documentation
- Kanban manufacturing
- JIT manufacturing
- Automated high-volume assembly
- SMT-automated pick and placed assemblies
- Statistical process control with real-time defect trend analysis and
data collection
- SMT and through-hole assembly mixed components assemblies
- Conformal coating services
- BGA and Re-balling
- Wire Harness / Cable Assembly
- Process capabilities
- No clean chemistry
- Water soluble chemistry
- Ionic contamination testing
- Wave soldering and selective soldering
- Auto insertion
- Multiple board finishes including HASL (leaded and Lead-Free), ENIG, Immersion Silver, OSP, and Immersion Tin
- Ball Grid Array (BGA) rework, re-balling and inspection services using x-ray
- Interconnection and packaging consulting
- Process development
- SMT assembly capabilities
- Single-sided component populated boards
- Double-sided component populated boards
- Single-layer rugged/heavy construction
- Multi-layer complex and handling sensitive boards
- Flexible circuit assemblies
- Low-volume to high-volume manufacturing
- Assembly capabilities span 0201 passives, 0.3mm QFPs, 0.5mm CSPs at one end of the dimensional scale to 1,180 pin BGA (0.4mm CSPs to 1600+ pin BGAs)
- Fine-pitched QFPs and passives
- Fine-pitch SMT connectors
- Plastic, tape, and ceramic ball grid arrays (BGAs)
- Chip scale packages
- High-density BGA
- High I/O BGA
- High-density, complex SMT
- High pincount interconnect
- PCMCIA
- Through-hole assembly capabilities
- Component lead forming: automatic and semi-automatic forming equipment
- Axial component sequencing
- Automatic or semi-automatic insertion
- Manual/mechanical assembly: application of staking, nuts/bolts, riveting
and studs
- Box build capabilities
- Full systems integration
- Sub assemblies and complete system assembly
- Power supplies
- Full product testing: digital, analog, RF, mixed technologies
- Configuration management
- Finished goods stocking programs
- End user order fulfillment capabilities
- Final system integration
- Design for Manufacturability capabilities
SigmaTron International provides customers with a plan to both
improve quality and reduce manufacturing costs by employing a Design
for Manufacturability (DFM) Review using Valor's vPlan Software
with access to Valor Part Library . This system integrates all incoming
logistical and engineering data into a single database for efficient
pre-production and communication.
- Circuit design
- Board design from schematics
- Mechanical and product design
- Sourcing and procurement
- Prototype and volume board assembly
- Design and implementation of product testing
- Warranty and repair services
Once all of the relevant data (bill of material, AVL, CAD, etc.)
is captured, the system is programmed to analyze and optimize for
manufacturability and assembly. Design verification is performed
based on pre-defined manufacturing constraints. As a result of the
verification process, productivity is improved, component and
manufacturing resources are optimized, and the final product is
far more reliable.
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