Services - Manufacturing

- New Product Introduction (NPI)

SigmaTron's New Product Introduction (NPI) team is a dedicated, self-directed work team that manages every detail of New Product Introductions, from prototype runs, to pilot production and pre-production manufacturing. Equipment dedicated to NPI activity includes:

• SMT line
• AOI
• Agilent 5DX
• Flying Probe Testing

The NPI process starts, and is driven by our NPI team, who ensure that all processes are ready for manufacturing and test. We also use our Valor software to perform DFM/DFT analysis as required. Activities you can expect from the SigmaTron International team include the following:

• Quotations and test strategy concepts
• Contact throughout the product development process
• Participation in design reviews providing DFM/DFT input
• Test plan development
• Budget and schedule
• Status review and presentations

- Testing and Test Development

SigmaTron's Test Engineers and Test Technicians provide:

• Burn-in test: Allows the lifetime of a new component to be accelerated by applying electrical stimulation at a high temperature, and immediately identifies any units that would otherwise have failed early in their lifetime. This allows flawed components to be rejected before distribution.
• In-circuit test:
  Verifies the correct assembly and operation of each board component, while the component is within the assembled circuit board. A bed-of-nails fixture with supporting test-programming code is used to access all electrical nets on the assembly. The test isolates faults to the component pin, identifies shorts on unconnected output pins, verifies the correct value of analog components and the correct placement and soldering of digital components including ASICs.

• Flying probe test:
  Four independent test probes simultaneously apply the stimuli and perform the measurements needed to fully test a printed circuit board. Active and passive analog tests, signature analysis on each test point, boundary scan, and component presence and orientation inspection are performed. This test, similar to in-circuit without the use of a fixture, is ideal for first-piece and prototyping to prove out a design. It saves our customers time and money by improving throughput for new product introductions and eliminating the need for costly replacement fixtures when assemblies are redesigned.
• MDA Test: (Manual Defect Analysis)
• Functional test:
  Functionality of the final product can be tested to our customer's specifications using customer-furnished test equipment or special test equipment and specifications developed by the SigmaTron International team. Technicians test for any abnormalities in the assembly, through all stages of development, to verify the assembly will function as intended and to increase confidence in the product.
• X-Ray Imaging:
  Quickly and automatically scans a printed circuit board assembly, analyzes the cross-sectional X-ray images, and identifies the exact location and characteristics of defective solder joints with typical coverage of up to 99%. SigmaTron International Manufacturing uses State of the Art X-Ray equipment to verify solder joints of BGA components, ensuring the quality of BGA placements and reducing costly and time consuming component removal and replacement
• Environmental stress screening (ESS):
  Performed on assemblies requiring high-reliability performance. This test precipitates and makes visible any existing latent flaws using thermal cycling as well as thermal shock to exercise the assemblies and expose faults. ESS cycles assemblies through both hot and cold temperatures for a specified duration to weed out infancy failures and assure that assemblies are functioning and reliable, improving customer satisfaction and product confidence in the field.

- Box Build Capabilities

- Cabling & Harness Manufacturing

- System Integration & Test

- Order Fulfillment & Configuration